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PACE · TF-1700
PACE TF-1700 BGA Rework System
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The PACE TF-1700 is a closed-loop convection BGA rework system for medium-to-large boards and packages. Programmable thermal profiles, board pre-heat, and optical alignment support consistent, documented rework on high-value assemblies.
Configuration depends on your board sizes and process requirements, so this item is quote-driven. KSC will scope the system and tooling to your application.
Specifications
- Process
- BGA rework
- Heating
- Closed-loop convection
- Board support
- Medium to large PCBs
- Profiles
- Programmable
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